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TDF Infrastructure issued a €600,000,000 bond maturing 21 July 2028

TDF Infrastructure announces today the successful settlement of €600 million 5.625% Bonds due 21 July 2028.

The offering was substantially oversubscribed by a large and diversified European investor base.

The net proceeds of the new bonds will be used for general corporate purposes (including refinancing corporate bank debt) and to finance the concurrent tender offer on the existing TDF Infrastructure €800,000,000 2.500% Bonds due April 2026, the results of which were announced on 20 July 2023.

The Prospectus related to this bond issuance has been approved by the AMF on 19 July 2023 and received the approval number 23-325 dated 19 July 2023. Copies of this Prospectus are available on the website of the AMF (www.amf-france.org) and on the website of the Issuer (www.tdf-infrastructure.com).

The Bonds have been rated BBB- by Fitch.

BNP Paribas and Crédit Agricole CIB acted as Global Coordinators together with Mediobanca, MUFG and Société Générale as Active Bookrunners, and BRED Banque populaire, Crédit Industriel et Commercial and La Banque Postale as Passive Bookrunners.

 

Disclaimer
This press release and the information contained herein do not constitute an offer to sell or subscribe, nor a solicitation
of an order to purchase or subscribe the bonds in any country, in particular in the United States. This press release and
the information contained herein also do not constitute an offer to purchase nor a solicitation to sell the bonds, nor an
invitation to participate to the offer to purchase. The distribution of this press release may be restricted in some countries and be subject to specific regulations and persons in possession of this press release should inform themselves
about and comply with any applicable restrictions.